Series Resonant Frequency

The inherent series resonant frequency (SRF) of a single layer chip capacitor is the highest of any discrete lumped constant capacitor. Since connections must be made to the chip, the resultant SRF is lowered and mainly determined by the inductance of the connections (wire or ribbon), the size of the chip, and the location of the connections. As a result of these variables, among others, the best feasible determination of usability is in situ.

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Common Configurations

CSA Part Number Assembly

Common Mounting Methods

  • Soldering with the use of pre-tinning and solder reflow, solder preforms, solder paste, etc.
  • Eutectic bonding with appropriate metallizations of the surfaces to be joined and the use of compatible interface preforms
  • Conductive Epoxy

Common Termination Methods

  • Soldering of wire or ribbon leads (minimum chip size limited by user’s soldering techniques)
  • Thermal compression, thermasonic, or ultrasonic bonding with gold wire

Voltage Rating:

Material Thickness WVDC
C-20 through C-1401 ≤ 5 mils 50
> 5 mils 100
C-200 and C-4002 5-10 mils


  1. Ratings up to 1,000V and higher available, consult factory
  2. Our Ultra-High K X7R material can be rated between 16 and 100WVDC depending on the component thickness and the requirements of your application. Please consult the factory to determine the optimum solution.

Capacitor General Electrical Characteristics

Operating Frequency:
Up to 100 GHz

Dielectric Test Voltage:
250% voltage rating,
impervious to static discharge

Test Frequency:
1 MHz @ 1V (below 1,000pF)
1 KHz @ 1V (above 1,000pF)


  • Microwave Integrated
  • GaAs Integrated Circuits
  • DC Blocking
  • RF Bypass
  • Decoupling
  • Temperature
    Compensation Circuits
  • LC Filter
  • Tuning